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AEM

AEM Hi-Rel

For Package information relevant to AEM Hi-Rel and its products, please contact our Applications Engineer.

AEM Components

For Package information relevant to AEMC and its products, please contact our Logistic Manager.

Renaissance

For Package information relevant to Renaissance and its products, please contact our Technical Sales Engineer.

Central Semiconductor

This page provides complete, easy-to-find guidance on the full range of packages manufactured by Central Semiconductor.

Details Provided:

  • Case mechanical dimensions
  • Tape and reel specifications
  • Part marking
  • Packing & shipping container specifications
  • Mounting pad geometry (SMD packages only)
  • Ammo pack specifications (through-hole packages only)
  • Package reliability summary reports

Available Packages

Central Semiconductor's full range of surface mount and through-hole packages can be found in the Package Option Guide:

Package Option Guide (PDF)

Surface Mount Packages

Package Details
BR DFN
BR DFN-A
CSP2X2
CSP3.5X2
CSP4X6
CSP5X4
D2PAK (TO-263)
DFN123F
DFN5X6A
DPAK (TO-252)

Showing 1–10 of 71

Through-Hole Packages

Package Details
AX-5W
CASE 106
CASE A
CASE B-M
CASE C
CASE CM
CASE D
CASE DM
CASE DMM
CASE FP

Showing 1–10 of 50

For documents that are not available, please use the Engineering Information Request system.