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AEM

2N2221A

40V,800mA,400mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current

Specifications

Base-Emitter Saturation Voltage (VBE(SAT))
2 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.6 — 1.2 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
75 V
Collector-Base Cutoff Current (ICBO)
10000 nA
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Time Constant (rb'Cc)
150 ps
Collector-Base Voltage
75 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Cutoff Current (ICEV)
0.01 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
1000 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
40 V
Continuous Collector Current
800 mA
Current Gain-Bandwidth Product (fT)
250 MHz
DC Current Gain (hFE)
20 x10³
DC Current Gain (hFE)
25 x10³
DC Current Gain (hFE)
35 x10³
DC Current Gain (hFE)
15 x10³
DC Current Gain (hFE)
40 — 120 x10³
DC Current Gain (hFE)
25 x10³
DC Current Gain (hFE)
20 x10³
Delay Time (td)
10 ns
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage
6 V
Fall Time (tf)
60 ns
HTS Code
8541.21.0075
Input Capacitance (Cib)
25 pF
Input Impedance Common Emitter (hie)
0.2 — 1 kΩ
Input Impedance Common Emitter (hie)
1 — 3.5 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Output Admittance Common Emitter (hoe)
10 — 100 µS
Output Admittance Common Emitter (hoe)
3 — 15 µS
Output Capacitance (Cob)
8 pF
Power Dissipation
1.2 W
Power Dissipation
400 mW
Rise Time (tr)
25 ns
Small Signal Current Gain (hfe)
50 — 300 x10³
Small Signal Current Gain (hfe)
30 — 150 x10³
Storage Temperature (Tstg)
-65 — 200 °C
Storage Time (ts)
225 ns
Thermal Resistance Junction-Ambient
438 °C/W
Thermal Resistance Junction-Case
146 °C/W
Voltage Feedback Ratio Common Emitter (hre)
0.25 x10⁻³
Voltage Feedback Ratio Common Emitter (hre)
0.5 x10⁻³

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTermination
Discontinued40V,800mA,400mW Through-Hole Transistor-Small Signal (<=1A) NPN High CurrentBox2,000PBFREE

Resources

ItemType
Analytical Test Report:Bond WireAnalytical Test Report
Analytical Test Report:CapAnalytical Test Report
Analytical Test Report:HeaderAnalytical Test Report
Analytical Test Report:Header AssemblyAnalytical Test Report
Analytical Test Report:Pure Tin SolderAnalytical Test Report
2N2221A.PDFDevice Datasheet
Material Composition:TO-18Material Composition
Package Detail Document:TO-18Package Detail Document
Product EOL Notice:2N2218AProduct EOL Notice
Product Reliability Data:TO-18 Package ReliabilityProduct Reliability Data

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