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2N2712
18V,100mA,200mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Specifications
Case Type
TO-92
Collector-Base Cutoff Current (ICBO)
15000 nA
Collector-Base Cutoff Current (ICBO)
500 nA
Collector-Base Voltage
18 V
Collector-Emitter Breakdown Voltage (BVCEO)
18 V
Collector-Emitter Voltage (VCEO)
18 V
Continuous Collector Current
100 mA
DC Current Gain (hFE)
75 — 225 x10³
ECCN Code
EAR99
Emitter-Base Cutoff Current (IEBO)
500 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-55 — 100 °C
Noise Figure (NF)
2.8 dB
Output Capacitance (Cob)
12 pF
Power Dissipation
200 mW
Storage Temperature (Tstg)
-55 — 125 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 18V,100mA,200mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 2,500 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| LSSGP072.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |