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2N2925
25V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise
Specifications
Case Type
TO-92
Collector-Base Cutoff Current (ICBO)
15000 nA
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage
25 V
Collector-Emitter Voltage (VCEO)
25 V
Continuous Collector Current
100 mA
DC Current Gain (hFE)
235 — 470 x10³
ECCN Code
EAR99
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-55 — 125 °C
Output Capacitance (Cob)
10 pF
Power Dissipation
250 mW
Power Dissipation
360 mW
Storage Temperature (Tstg)
-55 — 150 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 25V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | Box | 2,500 | LEAD or TIN | No | |
| Active | 25V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 25V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| LSSGP072.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |