2N3798A
90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise
Specifications
Base-Emitter On Voltage (VBE(ON))
0.7 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.7 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.8 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
90 V
Collector-Base Cutoff Current (ICBO)
10000 nA
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage
90 V
Collector-Emitter Breakdown Voltage (BVCEO)
90 V
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
90 V
Continuous Collector Current
50 mA
Current Gain-Bandwidth Product (fT)
80 MHz
Current Gain-Bandwidth Product (fT)
30 MHz
DC Current Gain (hFE)
150 x10³
DC Current Gain (hFE)
75 x10³
DC Current Gain (hFE)
150 — 450 x10³
DC Current Gain (hFE)
150 x10³
DC Current Gain (hFE)
125 x10³
DC Current Gain (hFE)
100 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
20 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
15 pF
Input Impedance Common Emitter (hie)
3 — 15 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
3 dB
Noise Figure (NF)
2.5 dB
Noise Figure (NF)
3.5 dB
Noise Figure (NF)
7 dB
Output Admittance Common Emitter (hoe)
5 — 60 µS
Output Capacitance (Cob)
5 pF
Power Dissipation
1.2 W
Power Dissipation
360 mW
Small Signal Current Gain (hfe)
150 — 600 x10³
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient
490 °C/W
Thermal Resistance Junction-Case
150 °C/W
Voltage Feedback Ratio Common Emitter (hre)
2.5 x10⁻³
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise | Box | 2,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| 2N3798.PDF | Device Datasheet |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |