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AEM

2N3799A

90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Specifications

Base-Emitter On Voltage (VBE(ON))
0.7 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.7 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.8 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
90 V
Collector-Base Cutoff Current (ICBO)
10000 nA
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage
90 V
Collector-Emitter Breakdown Voltage (BVCEO)
90 V
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
90 V
Continuous Collector Current
50 mA
Current Gain-Bandwidth Product (fT)
80 MHz
Current Gain-Bandwidth Product (fT)
30 MHz
DC Current Gain (hFE)
300 x10³
DC Current Gain (hFE)
150 x10³
DC Current Gain (hFE)
300 — 900 x10³
DC Current Gain (hFE)
300 x10³
DC Current Gain (hFE)
250 x10³
DC Current Gain (hFE)
75 x10³
DC Current Gain (hFE)
225 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
20 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
15 pF
Input Impedance Common Emitter (hie)
10 — 40 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
1.5 dB
Noise Figure (NF)
1.5 dB
Noise Figure (NF)
2.5 dB
Noise Figure (NF)
4 dB
Output Admittance Common Emitter (hoe)
5 — 60 µS
Output Capacitance (Cob)
5 pF
Power Dissipation
1.2 W
Power Dissipation
360 mW
Small Signal Current Gain (hfe)
300 — 900 x10³
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient
490 °C/W
Thermal Resistance Junction-Case
150 °C/W
Voltage Feedback Ratio Common Emitter (hre)
2.5 x10⁻³

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTerminationvariant_ncnr
Active90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low NoiseBox2,000LEAD or TINNo

Resources

ItemType
Analytical Test Report:Bond WireAnalytical Test Report
Analytical Test Report:CapAnalytical Test Report
Analytical Test Report:HeaderAnalytical Test Report
Analytical Test Report:Header AssemblyAnalytical Test Report
Analytical Test Report:Pure Tin SolderAnalytical Test Report
2N3798.PDFDevice Datasheet
Material Composition:TO-18Material Composition
Package Detail Document:TO-18Package Detail Document
Product Reliability Data:TO-18 Package ReliabilityProduct Reliability Data

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