2N3962
60V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise
Specifications
Base-Emitter Saturation Voltage (VBE(SAT))
0.95 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.9 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage
60 V
Collector-Emitter Breakdown Voltage (BVCES)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
60 V
Collector-Emitter Cutoff Current (ICES)
0.01 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
60 V
Continuous Collector Current
200 mA
Current Gain-Bandwidth Product (fT)
40 MHz
DC Current Gain (hFE)
100 — 300 x10³
DC Current Gain (hFE)
40 x10³
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
100 — 450 x10³
DC Current Gain (hFE)
600 x10³
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
90 x10³
DC Current Gain (hFE)
45 x10³
DC Current Gain (hFE)
60 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage
6 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
15 pF
Input Impedance Common Emitter (hie)
2.5 — 17 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
3 dB
Noise Figure (NF)
3 dB
Noise Figure (NF)
10 dB
Noise Figure (NF)
3 dB
Output Admittance Common Emitter (hoe)
5 — 40 µS
Output Capacitance (Cob)
6 pF
Power Dissipation
360 mW
Power Dissipation
1.2 W
Small Signal Current Gain (hfe)
100 — 550 x10³
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient
486 °C/W
Thermal Resistance Junction-Case
146 °C/W
Voltage Feedback Ratio Common Emitter (hre)
1 x10⁻³
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 60V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise | Box | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| LSSGP057.PDF | Device Datasheet |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |