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AEM

2N3963

80V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Specifications

Base-Emitter Saturation Voltage (VBE(SAT))
0.95 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.9 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
80 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage
80 V
Collector-Emitter Breakdown Voltage (BVCES)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
80 V
Collector-Emitter Cutoff Current (ICES)
0.01 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
80 V
Continuous Collector Current
200 mA
Current Gain-Bandwidth Product (fT)
40 MHz
DC Current Gain (hFE)
100 — 300 x10³
DC Current Gain (hFE)
40 x10³
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
100 — 450 x10³
DC Current Gain (hFE)
600 x10³
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
90 x10³
DC Current Gain (hFE)
45 x10³
DC Current Gain (hFE)
60 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage
6 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
15 pF
Input Impedance Common Emitter (hie)
2.5 — 17 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
3 dB
Noise Figure (NF)
3 dB
Noise Figure (NF)
10 dB
Noise Figure (NF)
3 dB
Output Admittance Common Emitter (hoe)
5 — 40 µS
Output Capacitance (Cob)
6 pF
Power Dissipation
360 mW
Power Dissipation
1.2 W
Small Signal Current Gain (hfe)
100 — 550 x10³
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient
486 °C/W
Thermal Resistance Junction-Case
146 °C/W
Voltage Feedback Ratio Common Emitter (hre)
1 x10⁻³

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTerminationvariant_ncnr
Active80V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low NoiseBox2,000LEAD or TINNo

Resources

ItemType
Analytical Test Report:Bond WireAnalytical Test Report
Analytical Test Report:CapAnalytical Test Report
Analytical Test Report:HeaderAnalytical Test Report
Analytical Test Report:Header AssemblyAnalytical Test Report
Analytical Test Report:Pure Tin SolderAnalytical Test Report
2N3963-3964.PDFDevice Datasheet
Material Composition:TO-18Material Composition
Package Detail Document:TO-18Package Detail Document
Product Reliability Data:TO-18 Package ReliabilityProduct Reliability Data
Spice Model:2N3963Spice Model

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