No image available
2N5306
300mA,25V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington
Specifications
Base-Emitter On Voltage (VBE(ON))
1.5 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.6 V
Case Type
TO-92
Collector-Base Breakdown Voltage (BVCBO)
25 V
Collector-Base Cutoff Current (ICBO)
20000 nA
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage
25 V
Collector-Emitter Breakdown Voltage (BVCEO)
25 V
Collector-Emitter Saturation Voltage (VCE(SAT))
1400 mV
Collector-Emitter Voltage (VCEO)
25 V
Continuous Base Current
50 mA
Continuous Collector Current
300 mA
Current Gain-Bandwidth Product (fT)
60 MHz
DC Current Gain (hFE)
20 x10³
DC Current Gain (hFE)
7 — 70 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
12 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage
12 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
12 pF
Input Impedance Common Emitter (hie)
650 kΩ
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
10 pF
Peak Collector Current
500 mA
Power Dissipation
1.5 W
Power Dissipation
625 mW
Small Signal Current Gain (hfe)
7 x10³
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
200 °C/W
Thermal Resistance Junction-Case
83.3 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 300mA,25V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Box | 2,500 | LEAD or TIN | No | |
| Active | 300mA,25V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 300mA,25V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| 2N5306_5308.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |