No image available
2N5818
40V,750mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current
Specifications
Base-Emitter On Voltage (VBE(ON))
0.6 — 1.1 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.2 V
Case Type
TO-92
Collector-Base Cutoff Current (ICBO)
15000 nA
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage
50 V
Collector-Emitter Breakdown Voltage (BVCES)
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Saturation Voltage (VCE(SAT))
750 mV
Collector-Emitter Voltage (VCEO)
40 V
Collector-Emitter Voltage (VCES)
50 V
Continuous Collector Current
750 mA
Current Gain-Bandwidth Product (fT)
135 MHz
DC Current Gain (hFE)
25 x10³
DC Current Gain (hFE)
150 — 300 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
10000 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0075
Input Capacitance (Cib)
55 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
15 pF
Peak Collector Current
1 A
Power Dissipation
1.5 W
Power Dissipation
625 mW
Storage Temperature (Tstg)
-65 — 150 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 40V,750mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current | Box | 2,000 | LEAD or TIN | No | |
| Active | 40V,750mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 40V,750mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| 2N5814-2N5819.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |