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2N6427
500mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington
Specifications
Base-Emitter On Voltage (VBE(ON))
1.75 V
Base-Emitter Saturation Voltage (VBE(SAT))
2 V
Case Type
TO-92
Collector-Base Breakdown Voltage (BVCBO)
40 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage
40 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Cutoff Current (ICEO)
1 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
1500 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
1200 mV
Collector-Emitter Voltage (VCEO)
40 V
Continuous Collector Current
500 mA
DC Current Gain (hFE)
20 — 200 x10³
DC Current Gain (hFE)
14 — 140 x10³
DC Current Gain (hFE)
10 — 100 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
12 V
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage
12 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-55 — 150 °C
Power Dissipation
1.5 W
Power Dissipation
625 mW
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient
200 °C/W
Thermal Resistance Junction-Case
83.3 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 500mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Box | 2,500 | LEAD or TIN | No | |
| Active | 500mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Box | 2,000 | PBFREE | ||
| Active | 500mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 500mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| LSSGP074.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:CP327V replacing CP307V | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |