2N7002
115mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Specifications
Case Type
SOT-23
Common Source Input Capacitance (Ciss)
50 pF
Common Source Output Capacitance (Coss)
25 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current
115 mA
Continuous Drain Current
75 mA
Continuous Source Current (Body Diode)
115 mA
Device Family
MOSFETs/JFETs
Diode Forward On Voltage (VSD)
1.5 V
Drain-Gate Voltage
60 V
Drain-Source Breakdown Voltage (BVDSS)
60 V
Drain-Source On Voltage (VDS(ON))
375 mV
Drain-Source On Voltage (VDS(ON))
3750 mV
Drain-Source Voltage
60 V
ECCN Code
EAR99
Forward Transconductance (gFS)
80 mS
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
1 — 2.5 V(2.1 V Typical)
Gate-Drain Charge (Qgd)
0.148 nC
Gate-Source Charge (Qgs)
0.196 nC
Gate-Source Voltage (VGS)
40 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current
800 mA
Maximum Pulsed Source Current
800 mA
On State Drain Current (ID(ON))
500 mA
Power Dissipation
350 mW
Saturation Drain Current (IDSS)
1 µA
Saturation Drain Current (IDSS)
500 µA
Static Drain-Source On Resistance (rDS(ON))
7.5 Ω
Static Drain-Source On Resistance (rDS(ON))
13.5 Ω
Static Drain-Source On Resistance (rDS(ON))
7.5 Ω
Static Drain-Source On Resistance (rDS(ON))
13.5 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Total Gate Charge (Qg)
0.592 nC
Turn Off Time (toff)
20 ns
Turn On Time (ton)
20 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode | Box | 3,500 | TIN | No | |
| Active | 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode | Tape & Reel | 3,000 | LEAD or TIN | No | |
| Active | 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode | Tape & Reel | 10,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| 2N7002.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N7002 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |