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AEM

BC300

80V,500mA,850mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch

Specifications

Case Type
TO-39
Collector-Base Cutoff Current (ICBO)
20 nA
Collector-Base Voltage
120 V
Collector-Emitter Breakdown Voltage (BVCEV)
120 V
Collector-Emitter Breakdown Voltage (BVCEO)
80 V
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
80 V
Continuous Collector Current
500 mA
Current Gain-Bandwidth Product (fT)
120 MHz
DC Current Gain (hFE)
40 — 240 x10³
DC Current Gain (hFE)
20 x10³
DC Current Gain (hFE)
20 x10³
ECCN Code
EAR99
Emitter-Base Cutoff Current (IEBO)
20 nA
Emitter-Base Voltage
7 V
HTS Code
8541.21.0075
Input Impedance Common Emitter (hie)
1.7 kΩ
Junction Temperature (Tj)
-65 — 150 °C
Output Admittance Common Emitter (hoe)
14 µS
Output Capacitance (Cob)
10 pF
Peak Base Current
500 mA
Peak Collector Current
1 A
Power Dissipation
6 W
Power Dissipation
850 mW
Small Signal Current Gain (hfe)
140 x10³
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
175 °C/W
Thermal Resistance Junction-Case
25 °C/W
Voltage Feedback Ratio Common Emitter (hre)
1.7 x10⁻³

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTermination
Active80V,500mA,850mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/SwitchBox500PBFREE

Resources

ItemType
Analytical Test Report:Bond WireAnalytical Test Report
Analytical Test Report:CapAnalytical Test Report
Analytical Test Report:HeaderAnalytical Test Report
Analytical Test Report:Header AssemblyAnalytical Test Report
Analytical Test Report:Pure Tin SolderAnalytical Test Report
LSSGP065.PDFDevice Datasheet
Material Composition:TO-39Material Composition
Package Detail Document:TO-39Package Detail Document
Product Reliability Data:TO-39 Package ReliabilityProduct Reliability Data

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