BC846BWR
65V,100mA,275mW Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Specifications
Base-Emitter On Voltage (VBE(ON))
0.77 V
Base-Emitter On Voltage (VBE(ON))
0.58 — 0.7 V
Case Type
SOT-323
Collector-Base Breakdown Voltage (BVCBO)
80 V
Collector-Base Cutoff Current (ICBO)
5000 nA
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Voltage
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
65 V
Collector-Emitter Saturation Voltage (VCE(SAT))
600 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
65 V
Continuous Collector Current
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
200 — 450 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0075
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
10 dB
Output Capacitance (Cob)
3 pF
Peak Base Current
200 mA
Peak Collector Current
200 µA
Power Dissipation
275 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
455 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Special Order Item | 65V,100mA,275mW Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| BC846W_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |