BC857CW
45V,100mA,250mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch
Specifications
Base-Emitter On Voltage (VBE(ON))
0.82 V
Base-Emitter On Voltage (VBE(ON))
0.6 — 0.75 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.95 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.9 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.7 V
Case Type
SOT-323
Collector-Base Breakdown Voltage (BVCBO)
50 V
Collector-Base Capacitance (Ccb)
4.5 pF
Collector-Base Cutoff Current (ICBO)
4000 nA
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Voltage
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
45 V
Collector-Emitter Saturation Voltage (VCE(SAT))
650 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
45 V
Continuous Collector Current
100 mA
Current Gain-Bandwidth Product (fT)
200 MHz
DC Current Gain (hFE)
420 — 800 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage
6 V
HTS Code
8541.21.0075
Junction Temperature (Tj)
-65 — 150 °C
Peak Base Current
200 mA
Peak Collector Current
200 mA
Power Dissipation
250 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 45V,100mA,250mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| BC856W_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:BC846AW thru BC857AW Series | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |