BCY78-X
32V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise
Specifications
Base-Emitter On Voltage (VBE(ON))
0.6 — 0.75 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.7 — 1.2 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.6 — 0.85 V
Case Type
TO-18
Collector-Base Breakdown Voltage (BVCBO)
32 V
Collector-Base Cutoff Current (ICBO)
10000 nA
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Voltage
32 V
Collector-Emitter Breakdown Voltage (BVCEO)
32 V
Collector-Emitter Saturation Voltage (VCE(SAT))
800 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
32 V
Continuous Collector Current
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
60 x10³
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
380 — 630 x10³
DC Current Gain (hFE)
240 — 1000 x10³
Delay Time (td)
35 ns
Delay Time (td)
50 ns
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
20 nA
Emitter-Base Voltage
5 V
Fall Time (tf)
100 ns
Fall Time (tf)
100 ns
HTS Code
8541.21.0075
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
10 dB
Output Capacitance (Cob)
7 pF
Peak Base Current
200 mA
Peak Collector Current
200 mA
Power Dissipation
1 W
Power Dissipation
340 mW
Rise Time (tr)
65 ns
Rise Time (tr)
50 ns
Storage Temperature (Tstg)
-65 — 200 °C
Storage Time (ts)
300 ns
Storage Time (ts)
600 ns
Thermal Resistance Junction-Ambient
450 °C/W
Thermal Resistance Junction-Case
150 °C/W
Turn Off Time (toff)
400 ns
Turn Off Time (toff)
700 ns
Turn On Time (ton)
100 ns
Turn On Time (ton)
100 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Limited Availability | 32V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise | Box | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| BCY78-79.PDF | Device Datasheet |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |