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AEM

CMBDM7590

140mA,20V Surface mount MOSFET P-Channel Enhancement Mode

Specifications

Case Type
SOT-923
Common Source Input Capacitance (Ciss)
12 pF
Common Source Output Capacitance (Coss)
2.7 pF
Common Source Reverse Transfer Capacitance (Crss)
1 pF
Continuous Drain Current
180 mA
Continuous Drain Current
140 mA
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage
20 V
ECCN Code
EAR99
Forward Transconductance (gFS)
1300 mS
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
0.4 — 1 V
Gate-Source Voltage (VGS)
8 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
125 mW
Saturation Drain Current (IDSS)
0.1 µA
Saturation Drain Current (IDSS)
0.05 µA
Static Drain-Source On Resistance (rDS(ON))
17 Ω
Static Drain-Source On Resistance (rDS(ON))
10 Ω
Static Drain-Source On Resistance (rDS(ON))
7 Ω
Static Drain-Source On Resistance (rDS(ON))
5 Ω
Static Drain-Source On Resistance (rDS(ON))
20 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
1000 °C/W
Turn Off Time (toff)
210 ns
Turn On Time (ton)
60 ns

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTermination
Discontinued, Stock Only140mA,20V Surface mount MOSFET P-Channel Enhancement ModeBox5,000PBFREE
Discontinued, Stock Only140mA,20V Surface mount MOSFET P-Channel Enhancement ModeTape & Reel8,000PBFREE

Resources

ItemType
Analytical Test Report:Green Epoxy Molding CompoundAnalytical Test Report
Analytical Test Report:Halogen Epoxy Molding CompoundAnalytical Test Report
Analytical Test Report:LeadframeAnalytical Test Report
Analytical Test Report:Sn PlatingAnalytical Test Report
CMBDM3590_7590.PDFDevice Datasheet
Material Composition:SOT-923Material Composition
Package Detail Document:SOT-923Package Detail Document
Product Reliability Data:SOT-923 Package ReliabilityProduct Reliability Data

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