No image available
CMLDM8120
860mA,20V Surface mount MOSFET P-Channel Enhancement Mode
Specifications
Case Type
SOT-563
Common Source Input Capacitance (Ciss)
200 pF
Common Source Output Capacitance (Coss)
60 pF
Common Source Reverse Transfer Capacitance (Crss)
80 pF
Continuous Drain Current
950 mA
Continuous Drain Current
860 mA
Continuous Source Current (Body Diode)
360 mA
Diode Forward On Voltage (VSD)
0.9 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage
20 V
ECCN Code
EAR99
Forward Transconductance (gFS)
2000 mS
Gate Leakage Current, Forward (IGSSF)
50 nA
Gate Leakage Current, Reverse (IGSSR)
50 nA
Gate Threshold Voltage (VGS(th))
0.45 — 1 V(0.76 V Typical)
Gate-Drain Charge (Qgd)
1.52 nC
Gate-Source Charge (Qgs)
0.36 nC
Gate-Source Voltage (VGS)
8 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current
4 A
Maximum Pulsed Source Current
4 A
Power Dissipation
300 mW
Power Dissipation
150 mW
Power Dissipation
350 mW
Saturation Drain Current (IDSS)
0.5 µA
Static Drain-Source On Resistance (rDS(ON))
0.2 Ω
Static Drain-Source On Resistance (rDS(ON))
0.142 Ω
Static Drain-Source On Resistance (rDS(ON))
0.15 Ω
Static Drain-Source On Resistance (rDS(ON))
0.24 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Total Gate Charge (Qg)
3.56 nC
Turn Off Time (toff)
25 ns
Turn On Time (ton)
20 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode | Box | 5,000 | PBFREE | ||
| Active | 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode | Box | 5,000 | PBFREE | ||
| Active | 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode | Tape & Reel | 3,000 | TIN | No | |
| Active | 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLDM8120.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SMD MOSFET Halogen Free Mold | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLDM8120 | Spice Model |