No image available
CMLM0574
Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode
Specifications
Case Type
SOT-563
Common Source Input Capacitance (Ciss)
43 pF
Common Source Output Capacitance (Coss)
8 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current
450 mA
Continuous Forward Current
500 mA
Diode Forward On Voltage (VSD)
0.5 — 1.1 V
Drain-Source Breakdown Voltage (BVDSS)
30 V
Drain-Source Voltage
30 V
ECCN Code
EAR99
Forward Transconductance (gFS)
200 mS
Forward Voltage (VF)
0.27 V
Forward Voltage (VF)
0.13 V
Forward Voltage (VF)
0.35 V
Forward Voltage (VF)
0.47 V
Forward Voltage (VF)
0.21 V
Gate Leakage Current, Forward (IGSSF)
3000 nA
Gate Leakage Current, Reverse (IGSSR)
3000 nA
Gate Threshold Voltage (VGS(th))
0.5 — 1 V
Gate-Drain Charge (Qgd)
0.23 nC
Gate-Source Charge (Qgs)
0.15 nC
Gate-Source Voltage (VGS)
8 V
HTS Code
8541.50.0080
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
10 A
Peak Repetitive Forward Current
3.5 A
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
300 mW
Power Dissipation
150 mW
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
20 µA
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
0.56 Ω
Static Drain-Source On Resistance (rDS(ON))
0.46 Ω
Static Drain-Source On Resistance (rDS(ON))
0.73 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Total Gate Charge (Qg)
0.792 nC
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Discontinued, Stock Only | Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode | Box | 5,000 | PBFREE | ||
| Discontinued, Stock Only | Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLM0574.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLM0574_MOSFET | Spice Model |
| Spice Model:Spice Model CMLM0574_SCHOTTKY | Spice Model |