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CMLT5087EM
50V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual PNP Low Noise Amplifier
Specifications
Base-Emitter On Voltage Matching (|VBE1-VBE2|)
10 mV
Base-Emitter On Voltage Matching (|VBE1-VBE2|)
10 mV
Base-Emitter On Voltage Matching (|VBE1-VBE2|)
10 mV
Base-Emitter On Voltage Matching (|VBE1-VBE2|)
10 mV
Base-Emitter Saturation Voltage (VBE(SAT))
0.8 V
Case Type
SOT-563
Collector-Base Breakdown Voltage (BVCBO)
50 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
50 V
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
100 mV
Collector-Emitter Voltage (VCEO)
50 V
Continuous Collector Current
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
300 x10³
DC Current Gain (hFE)
300 x10³
DC Current Gain (hFE)
50 x10³
DC Current Gain (hFE)
300 — 900 x10³(390 x10³ Typical)
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage
5 V
HTS Code
8541.21.0075
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
3 dB
Output Capacitance (Cob)
4 pF
Power Dissipation
350 mW
Small Signal Current Gain (hfe)
350 — 1400 x10³
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 50V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual PNP Low Noise Amplifier | Box | 5,000 | PBFREE | ||
| Active | 50V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual PNP Low Noise Amplifier | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLT5087EM.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |