CMPF5486
2V,6V,10mA,350mW Surface mount JFET N Channel
Specifications
Case Type
SOT-23
Common Source Input Capacitance (Ciss)
5 pF
Common Source Output Capacitance (Coss)
2 pF
Common Source Power Gain (GPS)
10 — 20 dB
Common Source Power Gain (GPS)
18 — 30 dB
Common Source Reverse Transfer Capacitance (Crss)
1 pF
Continuous Drain Current
30 mA
Continuous Gate Current
10 mA
Drain-Gate Voltage
25 V
ECCN Code
EAR99
Forward Transadmittance (gfs)
3.5 mS
Forward Transadmittance (gfs)
4 — 8 mS
Gate Leakage Current (IGSS)
200 nA
Gate Leakage Current (IGSS)
1 nA
Gate-Source Breakdown Voltage (BVGSS)
25 V
Gate-Source Cutoff Voltage (VGS(OFF))
2 — 6 V
Gate-Source Voltage (VGS)
25 V
HTS Code
8541.21.0095
Input Conductance (gis)
1000 µS
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
2 dB
Noise Figure (NF)
4 dB
Noise Figure (NF)
2.5 dB
Output Conductance (gos)
100 µS
Output Conductance (gos)
75 µS
Power Dissipation
350 mW
Saturation Drain Current (IDSS)
8000 — 20000 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 2V,6V,10mA,350mW Surface mount JFET N Channel | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPF5484.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CP210->CP232V | Process Change Notice |
| Product Brief:PB JFETs | Product Brief |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:CMPF5486 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |