CMPP6027
40V,150mA Surface mount Programmable UJT
Specifications
Anode-Cathode Voltage
40 V
Case Type
SOT-23
DC Forward Anode Current
150 mA
DC Gate Current
50 mA
ECCN Code
EAR99
Forward Voltage (VF)
1.5 V
Gate-Anode Leakage Current (IGAO)
10 nA
Gate-Anode Reverse Voltage
40 V
Gate-Cathode Forward Voltage
40 V
Gate-Cathode Leakage Current (IGKS)
50 nA
Gate-Cathode Reverse Voltage
5 V
HTS Code
8541.30.0080
Junction Temperature (Tj)
-55 — 150 °C
Offset Voltage (VT)
0.2 — 0.6 V
Offset Voltage (VT)
0.2 — 1.6 V
Peak Current (IP)
5 µA
Peak Current (IP)
2 µA
Peak One Cycle Surge Current
5 A
Peak Repetitive Forward Current
2 A
Peak Repetitive Forward Current
1 A
Power Dissipation
167 mW
Pulse Output Voltage (VO)
6 V
Pulse Voltage Rate of Rise (tr)
80 ns
Storage Temperature (Tstg)
-50 — 100 °C
Thermal Resistance Junction-Ambient
450 °C/W
Valley Current (IV)
70 µA
Valley Current (IV)
1500 µA
Valley Current (IV)
50 µA
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 40V,150mA Surface mount Programmable UJT | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPP6027_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |