CMPT3646
15V,200mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Saturated Switch
Specifications
Base-Emitter Saturation Voltage (VBE(SAT))
1.2 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.7 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.75 — 0.95 V
Case Type
SOT-23
Collector-Base Breakdown Voltage (BVCBO)
40 V
Collector-Base Voltage
40 V
Collector-Emitter Breakdown Voltage (BVCES)
40 V
Collector-Emitter Breakdown Voltage (BVCEO)
15 V
Collector-Emitter Cutoff Current (ICES)
0.5 µA
Collector-Emitter Cutoff Current (ICES)
3 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
280 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Voltage (VCEO)
15 V
Collector-Emitter Voltage (VCES)
40 V
Continuous Collector Current
200 mA
Current Gain-Bandwidth Product (fT)
350 MHz
DC Current Gain (hFE)
30 — 120 x10³
DC Current Gain (hFE)
25 x10³
DC Current Gain (hFE)
15 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Voltage
5 V
HTS Code
8541.21.0075
Input Capacitance (Cib)
8 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
5 pF
Power Dissipation
350 mW
Storage Temperature (Tstg)
-65 — 150 °C
Storage Time (ts)
18 ns
Thermal Resistance Junction-Ambient
357 °C/W
Turn Off Time (toff)
28 ns
Turn On Time (ton)
18 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 15V,200mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Saturated Switch | Box | 3,500 | PBFREE | ||
| Discontinued | 15V,200mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Saturated Switch | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPT3646.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product EOL Notice:CP246 WAFER PROCESS | Product EOL Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |