CMPT5962
45V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Low Noise
Specifications
Base-Emitter On Voltage (VBE(ON))
0.5 — 0.7 V
Case Type
SOT-23
Collector-Base Breakdown Voltage (BVCBO)
45 V
Collector-Base Cutoff Current (ICBO)
2 nA
Collector-Base Voltage
45 V
Collector-Emitter Breakdown Voltage (BVCEO)
45 V
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Voltage (VCEO)
45 V
Continuous Collector Current
50 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
500 x10³
DC Current Gain (hFE)
550 x10³
DC Current Gain (hFE)
600 — 1400 x10³
DC Current Gain (hFE)
450 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
7 V
Emitter-Base Cutoff Current (IEBO)
1 nA
Emitter-Base Voltage
7 V
HTS Code
8541.21.0075
Input Capacitance (Cib)
10 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
4 pF
Power Dissipation
350 mW
Small Signal Current Gain (hfe)
600 — 2000 x10³
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 45V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Low Noise | Box | 3,500 | PBFREE | |
| Active | 45V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN Low Noise | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPT5962.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |