CMPTA56
80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch
Specifications
Base-Emitter On Voltage (VBE(ON))
1.2 V
Case Type
SOT-23
Collector-Base Cutoff Current (ICBO)
20000 nA
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
80 V
Collector-Emitter Cutoff Current (ICEO)
0.1 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Voltage (VCEO)
80 V
Continuous Base Current
100 mA
Continuous Collector Current
500 mA
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
100 x10³
DC Current Gain (hFE)
100 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
4 V
Emitter-Base Voltage
4 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 175 °C
Peak Base Current
200 mA
Power Dissipation
350 mW
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Ambient
429 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch | Box | 3,500 | PBFREE | ||
| Active | 80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPTA06-A56.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPTA56 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |