CMST3904
Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Specifications
Base Cutoff Current (IBL)
50 nA
Base-Emitter Saturation Voltage (VBE(SAT))
0.95 V
Base-Emitter Saturation Voltage (VBE(SAT))
0.65 — 0.85 V
Case Type
SOT-323
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Voltage
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Cutoff Current (ICEV)
0.05 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV
Collector-Emitter Voltage (VCEO)
40 V
Continuous Collector Current
200 mA
Current Gain-Bandwidth Product (fT)
300 MHz
DC Current Gain (hFE)
70 x10³
DC Current Gain (hFE)
100 — 300 x10³
DC Current Gain (hFE)
60 x10³
DC Current Gain (hFE)
30 x10³
DC Current Gain (hFE)
40 x10³
Delay Time (td)
35 ns
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Voltage
6 V
Fall Time (tf)
80 ns
HTS Code
8541.21.0075
Input Capacitance (Cib)
12 pF
Input Impedance Common Emitter (hie)
1 — 10 kΩ
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
5 dB
Output Admittance Common Emitter (hoe)
1 — 40 µS
Output Capacitance (Cob)
4 pF
Power Dissipation
275 mW
Rise Time (tr)
35 ns
Small Signal Current Gain (hfe)
100 — 400 x10³
Storage Temperature (Tstg)
-65 — 150 °C
Storage Time (ts)
170 ns
Thermal Resistance Junction-Ambient
455 °C/W
Voltage Feedback Ratio Common Emitter (hre)
0.05 — 0.8 x10⁻³
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 5,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMST3904-06.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CP192V/CP592V DIE SHRINK | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMST3904 | Spice Model |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |