CP324X-2N7002A
Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.21.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET | WafflePack | 400 | PBFREE | |
| Active | Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET | WafflePack | 400 | PBFREE | |
| Active | Up-Screened Bare Die MIL-PRF-38534 Class H Equivalent,21.650 X 21.650 mils,Bare Die,N-Chan Enhancement Mode MOSFET | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CP324X-2N7002A_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Spice Model:Spice Model CP324X | Spice Model |