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CPC08-SIC04-650
Bare die,39.400 X 39.400 mils,4A, 650V SiC Schottky Diode
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.10.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,39.400 X 39.400 mils,4A, 650V SiC Schottky Diode | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPC08-SIC04-650_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Product Brief:PB for Silicon Carbide Die | Product Brief |