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CPC13-SIC50-1200
Bare die,179.500 X 179.500 mils,50A, 1200V SiC Schottky Diode
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.10.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,179.500 X 179.500 mils,50A, 1200V SiC Schottky Diode | WafflePack | 49 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Application Brief:Electric Vehicle Charging | Application Brief |
| CPC13-SIC50-1200_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Product Brief:PB for Silicon Carbide Die | Product Brief |