CPD04-1N647
Bare die,25.800 X 25.800 mils,Diode-Switching,0.5A Rectifier
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.10.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,25.800 X 25.800 mils,Diode-Switching,0.5A Rectifier | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD04-1N647_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CPD04 Wafer Thickness Increase | Process Change Notice |
| Spice Model:Spice Model CPD04 | Spice Model |