CPD104R-CFSH2-3L
200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A)
Specifications
Average Forward Current
200 mA
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
Forward Voltage (VF)
0.25 V
Forward Voltage (VF)
0.3 V
Forward Voltage (VF)
0.4 V
Forward Voltage (VF)
0.48 V
Forward Voltage (VF)
0.19 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
25 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
3 A
Peak Repetitive Reverse Voltage
30 V
Power Dissipation
100 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Voltage Leakage Current (IR)
50 µA
Reverse Voltage Leakage Current (IR)
10 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
1250 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A) | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD104R-CFSH2-3L_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Spice Model:Spice Model CPD104R | Spice Model |