CPD112R-SH05-20L
Bare die,14.960 X 14.960 mils,Low VF Schottky Diode
Specifications
Average Forward Current
500 mA
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
20 V
ECCN Code
EAR99
Forward Voltage (VF)
0.29 V
Forward Voltage (VF)
0.18 V
Forward Voltage (VF)
0.38 V
Forward Voltage (VF)
0.5 V
Forward Voltage (VF)
0.24 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
30 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
3 A
Peak Repetitive Reverse Voltage
20 V
Reverse Breakdown Voltage (BVR)
20 V
Reverse Voltage Leakage Current (IR)
30 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
1000 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,14.960 X 14.960 mils,Low VF Schottky Diode | WafflePack | 400 | PBFREE | |
| Active | Bare die,14.960 X 14.960 mils,Low VF Schottky Diode | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD112R-CFSH05-20L_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |