CPD18-1N5811
Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns,8A Ultra Fast Rec. Rectifier
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.10.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns,8A Ultra Fast Rec. Rectifier | WafflePack | 100 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD18-1N5811_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Spice Model:Spice Model CPD18-1N5811 | Spice Model |