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CPD24-CMR1F-08M
Bare die,50.500 X 50.500 mils,1A Fast Recovery Rectifier
Specifications
Average Forward Current
1 A
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
600 V
ECCN Code
EAR99
Forward Voltage (VF)
1.3 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
35 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
30 A
Peak Repetitive Reverse Voltage
600 V
Reverse Recovery Time (trr)
250 ns
Reverse Voltage Leakage Current (IR)
200 µA
Reverse Voltage Leakage Current (IR)
5 µA
RMS Reverse Voltage
420 V
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Lead
30 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Bare die,50.500 X 50.500 mils,1A Fast Recovery Rectifier | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD24-CMR1F-08M_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Spice Model:Spice Model CPD24 | Spice Model |