CPD69-CMR1-02M
1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose
Specifications
Average Forward Current
1 A
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
200 V
ECCN Code
EAR99
Forward Voltage (VF)
1.1 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
8 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
30 A
Peak Repetitive Reverse Voltage
200 V
Reverse Voltage Leakage Current (IR)
50 µA
Reverse Voltage Leakage Current (IR)
5 µA
RMS Reverse Voltage
140 V
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Lead
30 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD69-CMR1-02M_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CPD69 Wafer Thickness Increase | Process Change Notice |
| Spice Model:Spice Model CPD69 | Spice Model |