CPD76X-1N5818
1A,30V Bare die,32.300 X 32.300 mils,Rectifier-Schottky (>=1A)
Specifications
Average Forward Current
1 A
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
30 V
ECCN Code
EAR99
Forward Voltage (VF)
0.875 V
Forward Voltage (VF)
0.33 V
Forward Voltage (VF)
0.55 V
HTS Code
8541.10.0040
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
25 A
Peak Repetitive Reverse Voltage
30 V
Reverse Voltage Leakage Current (IR)
10000 µA
Reverse Voltage Leakage Current (IR)
1000 µA
RMS Reverse Voltage
21 V
Storage Temperature (Tstg)
-65 — 150 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Please Call | 1A,30V Bare die,32.300 X 32.300 mils,Rectifier-Schottky (>=1A) | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD76X-1N5818_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |