CPD83V-1N4153
150mA,75V Bare die,11.027 X 11.027 mils,Diode-Switching
Specifications
Average Forward Current
150 mA
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
50 V
ECCN Code
EAR99
Forward Voltage (VF)
0.62 — 0.7 V
Forward Voltage (VF)
0.7 — 0.81 V
Forward Voltage (VF)
0.74 — 0.88 V
Forward Voltage (VF)
0.49 — 0.55 V
Forward Voltage (VF)
0.53 — 0.59 V
Forward Voltage (VF)
0.59 — 0.67 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current
1 A
Peak Repetitive Reverse Voltage
75 V
Power Dissipation
500 mW
Power Dissipation
500 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
2 ns
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
50 µA
Reverse Voltage Leakage Current (IR)
0.05 µA
Storage Temperature (Tstg)
-65 — 200 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 150mA,75V Bare die,11.027 X 11.027 mils,Diode-Switching | WafflePack | 400 | PBFREE | |
| Active | 150mA,75V Bare die,11.027 X 11.027 mils,Diode-Switching | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD83V-1N4153_WPD.pdf | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |