CPD83V-CMPD7000
200mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching
Specifications
Average Forward Current
200 mA
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
Forward Voltage (VF)
0.67 — 0.82 V
Forward Voltage (VF)
0.75 — 1.1 V
Forward Voltage (VF)
0.55 — 0.7 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
2.6 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current
500 mA
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.5 µA
Reverse Voltage Leakage Current (IR)
0.3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD83V-CMPD7000_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Spice Model:Spice Model CPD83V | Spice Model |