CPD91V-CD6001
Bare die,11.030 X 11.030 mils,Low Leakage Switching Diode
Specifications
Average Forward Current
250 mA
Case Type
CHIP,WAFFLE
Continuous Reverse Voltage
75 V
ECCN Code
EAR99
Forward Voltage (VF)
0.95 V
Forward Voltage (VF)
1.1 V
Forward Voltage (VF)
0.85 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
3000 ns
Reverse Voltage Leakage Current (IR)
0.0005 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Case
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Special Order Item | Bare die,11.030 X 11.030 mils,Low Leakage Switching Diode | WafflePack | 200 | PBFREE | |
| Special Order Item | Bare die,11.030 X 11.030 mils,Low Leakage Switching Diode | WafflePack | 200 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD91V-CMPD6001_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |