CPD98V-CMUSH2-4
40V Bare die,11.024 X 11.024 mils,Diode-Schottky (<1A)
Specifications
Case Type
CHIP,WAFFLE
Continuous Forward Current
200 mA
ECCN Code
EAR99
Forward Voltage (VF)
0.6 V
Forward Voltage (VF)
0.26 V
Forward Voltage (VF)
0.75 V
Forward Voltage (VF)
0.31 V
Forward Voltage (VF)
0.33 V
HTS Code
8541.10.0040
Junction Capacitance (CJ)
10 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
600 mA
Peak Repetitive Forward Current
300 mA
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 40V Bare die,11.024 X 11.024 mils,Diode-Schottky (<1A) | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPD98V-CMUSH2-4_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |