CPL03-CJD0500
Bare die,15.700 X 15.700 mils,CLD Series
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
HTS Code
8541.10.0040
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Special Order Item | Bare die,15.700 X 15.700 mils,CLD Series | WafflePack | 200 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPL03-CMJD0130_SERIES_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |