CPZ25-CMZ5937B
33V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener
Specifications
Case Type
CHIP,WAFFLE
ECCN Code
EAR99
Forward Voltage (VF)
1.5 V
HTS Code
8541.10.0040
Junction Temperature (Tj)
-65 — 150 °C
Maximum Zener Current
45 mA
Peak Forward Surge Current
10 A
Peak Pulse Power
1 kW
Peak Pulse Power
200 W
Power Dissipation
500 mW
Power Dissipation
1.5 W
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
250 °C/W
Thermal Resistance Junction-Lead
50 °C/W
Zener Impedance (ZZT)
33 Ω
Zener Knee Impedance (ZZK)
800 Ω
Zener Voltage (VZ)
31.35 — 34.65 V(33 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 33V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener | WafflePack | 400 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| CPZ25-CMZ5913B_SERIES_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |