CQ89-2M
2A,600V Surface mount TRIAC
Specifications
Average Gate Power
200 mW
Case Type
SOT-89
ECCN Code
EAR99
Forward Voltage (VTM)
1.75 V
Forward Voltage (VTM)
2 V
Gate Trigger Current (IGT)
8 mA
Gate Trigger Current (IGT)
5 mA
Gate Trigger Voltage (VGT)
1.8 V
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current
1.2 A
Peak Forward Gate Voltage
8 V
Peak Gate Power
3 W
Peak Off-State Blocking Current (IDRM)
200 µA
Peak Off-State Blocking Current (IDRM)
5 µA
Peak One Cycle Surge Current
20 A
Peak Repetitive Off-State Voltage
600 V
Peak Repetitive Reverse Voltage
600 V
Peak Reverse Blocking Current (IRRM)
200 µA
Peak Reverse Blocking Current (IRRM)
5 µA
Rate of Rise of Reverse Voltage (dv/dt)
2.5 V/µs
RMS On-State Current
2 A
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient
180 °C/W
Thermal Resistance Junction-Case
90 °C/W
Value For Fusing
2
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 2A,600V Surface mount TRIAC | Tape & Reel | 1,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CQ89-2M.PDF | Device Datasheet |
| Material Composition:SOT-89 | Material Composition |
| Package Detail Document:SOT-89 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
| Product EOL Notice:CQ89-2M | Product EOL Notice |
| Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |