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CQ92D
1A,400V Through-Hole TRIAC
Specifications
Average Gate Power
200 mW
Case Type
TO-92
ECCN Code
EAR99
Forward Voltage (VTM)
1.26 V
Gate Trigger Current (IGT)
5 mA
Gate Trigger Voltage (VGT)
2 V
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current
1.2 A
Peak Forward Gate Voltage
8 V
Peak Gate Power
3 W
Peak Off-State Blocking Current (IDRM)
200 µA
Peak Off-State Blocking Current (IDRM)
5 µA
Peak One Cycle Surge Current
20 A
Peak Repetitive Off-State Voltage
400 V
Peak Repetitive Reverse Voltage
400 V
Peak Reverse Blocking Current (IRRM)
200 µA
Peak Reverse Blocking Current (IRRM)
5 µA
Rate of Rise of Reverse Voltage (dv/dt)
30 V/µs
RMS On-State Current
1 A
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient
180 °C/W
Thermal Resistance Junction-Case
90 °C/W
Value For Fusing
2
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 1A,400V Through-Hole TRIAC | Box | 2,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| CQ92B.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product EOL Notice:CQ92 Series | Product EOL Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |