CSL05D
400W,5V Surface mount Transient Voltage Suppressor Low Capacitance Array (<=10pF)
Specifications
Breakdown Voltage (VBR)
6 V
Case Type
SOT-23
Dynamic Resistance (RDYN)
0.57 Ω
ECCN Code
EAR99
Electrical Fast Transient
40 A
ESD Voltage
25 kV
ESD Voltage
25 kV
HTS Code
8541.10.0080
Junction Capacitance (CJ)
1.2 pF
Junction Temperature (Tj)
-50 — 125 °C
Maximum Clamping Voltage (VC)
12 V
Maximum Clamping Voltage (VC)
9.5 V
Peak Pulse Current
17 A
Peak Pulse Power
400 W
Reverse Stand-Off Voltage
5 V
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-50 — 150 °C
Typical Clamping Voltage (VCL)
15 V
Typical Clamping Voltage (VCL)
10 V
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 400W,5V Surface mount Transient Voltage Suppressor Low Capacitance Array (<=10pF) | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CSL05.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:Tin Wafer Backside Metal | Process Change Notice |
| Product EOL Notice:CSL05 / CSL05D | Product EOL Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |