CSLCDM22011-225F
Up-Screened Through-Hole Assembled Device Rad Tested
Specifications
Case Type
TO-220FP
ECCN Code
EAR99
HTS Code
8541.90.0000
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Up-Screened Through-Hole Assembled Device Rad Tested | Sleeve | 50 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe and Jump Bar | Analytical Test Report |
| Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
| Analytical Test Report:Plating | Analytical Test Report |
| Analytical Test Report:Pure Tin Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CSLCDM22011-225F.PDF | Device Datasheet |
| Package Detail Document:TO-220FP | Package Detail Document |
| Product Brief:PB Spacellite-C MOSFET | Product Brief |
| Spice Model:CSLCDM22011-225F | Spice Model |