CTLM8110-M832D
Surface mount Module 860mA,20V P-Channel MOSFET&1A,40V Low VF Schottky Rectifier
Specifications
Case Type
TLM832D
Common Source Input Capacitance (Ciss)
200 pF
Common Source Output Capacitance (Coss)
60 pF
Common Source Reverse Transfer Capacitance (Crss)
80 pF
Continuous Drain Current
950 mA
Continuous Drain Current
860 mA
Continuous Forward Current
1 A
Continuous Source Current (Body Diode)
360 mA
Diode Forward On Voltage (VSD)
0.9 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage
20 V
ECCN Code
EAR99
Forward Transconductance (gFS)
2000 mS
Forward Voltage (VF)
0.29 V
Forward Voltage (VF)
0.36 V
Forward Voltage (VF)
0.45 V
Forward Voltage (VF)
0.55 V
Gate Leakage Current, Forward (IGSSF)
50 nA
Gate Leakage Current, Reverse (IGSSR)
50 nA
Gate Threshold Voltage (VGS(th))
0.45 — 1 V(0.76 V Typical)
Gate-Drain Charge (Qgd)
1.52 nC
Gate-Source Charge (Qgs)
0.36 nC
Gate-Source Voltage (VGS)
8 V
HTS Code
8541.50.0080
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current
4 A
Maximum Pulsed Source Current
4 A
Peak Forward Surge Current
10 A
Peak Repetitive Forward Current
3.5 A
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
1.65 W
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
20 µA
Reverse Voltage Leakage Current (IR)
50 µA
Reverse Voltage Leakage Current (IR)
10 µA
Saturation Drain Current (IDSS)
0.5 µA
Static Drain-Source On Resistance (rDS(ON))
0.2 Ω
Static Drain-Source On Resistance (rDS(ON))
0.15 Ω
Static Drain-Source On Resistance (rDS(ON))
0.142 Ω
Static Drain-Source On Resistance (rDS(ON))
0.24 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
76 °C/W
Total Gate Charge (Qg)
3.56 nC
Turn Off Time (toff)
25 ns
Turn On Time (ton)
20 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | Surface mount Module 860mA,20V P-Channel MOSFET&1A,40V Low VF Schottky Rectifier | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CTLM8110-M832D.PDF | Device Datasheet |
| Package Detail Document:TLM832D | Package Detail Document |
| Process Change Notice:TLM832D Leadframe change from | Process Change Notice |
| Product EOL Notice:BLANKET PDN-ALL OTHER PRODUCTS | Product EOL Notice |