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J201
.3V,1.5V,50mA,350mW Through-Hole JFET N Channel
Specifications
Case Type
TO-92
Common Source Input Capacitance (Ciss)
5 pF
Common Source Reverse Transfer Capacitance (Crss)
2 pF
Continuous Gate Current
50 mA
Drain-Gate Voltage
40 V
ECCN Code
EAR99
Forward Transadmittance (gfs)
0.5 mS
Gate Leakage Current (IGSS)
1 nA
Gate-Source Breakdown Voltage (BVGSS)
42 V
Gate-Source Cutoff Voltage (VGS(OFF))
0.3 — 1.5 V
Gate-Source Voltage (VGS)
40 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
350 mW
Saturation Drain Current (IDSS)
200 — 1000 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Case
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | .3V,1.5V,50mA,350mW Through-Hole JFET N Channel | Box | 2,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| J201.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model J201 | Spice Model |