No image available
MPSA44
400V,300mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Voltage
Specifications
Base-Emitter Saturation Voltage (VBE(SAT))
0.75 V
Case Type
TO-92
Collector-Base Breakdown Voltage (BVCBO)
500 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage
500 V
Collector-Emitter Breakdown Voltage (BVCES)
500 V
Collector-Emitter Breakdown Voltage (BVCEO)
400 V
Collector-Emitter Cutoff Current (ICES)
0.5 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
750 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Voltage (VCEO)
400 V
Continuous Collector Current
300 mA
Current Gain-Bandwidth Product (fT)
20 MHz
DC Current Gain (hFE)
50 — 200 x10³
DC Current Gain (hFE)
45 x10³
DC Current Gain (hFE)
40 x10³
DC Current Gain (hFE)
40 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage
6 V
HTS Code
8541.21.0095
Input Capacitance (Cib)
110 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
6 pF
Power Dissipation
625 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
200 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 400V,300mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Voltage | Box | 2,500 | LEAD or TIN | No | |
| Active | 400V,300mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Voltage | Box | 2,000 | PBFREE | ||
| Active | 400V,300mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Voltage | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 400V,300mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN High Voltage | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| MPSA44-45.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:I-Spice Model MPSA44 | Spice Model |
| Spice Model:P-Spice Model MPSA44 | Spice Model |