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PN3643
30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Specifications
Amplifier Power Gain (Gpe)
10 dB
Case Type
TO-92
Collector Efficiency (η)
60 %
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Voltage
60 V
Collector-Emitter Breakdown Voltage (BVCES)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Cutoff Current (ICES)
0.05 µA
Collector-Emitter Saturation Voltage (VCE(SAT))
220 mV
Collector-Emitter Voltage (VCEO)
30 V
Continuous Collector Current
500 mA
Current Gain-Bandwidth Product (fT)
250 MHz
DC Current Gain (hFE)
25 x10³
DC Current Gain (hFE)
100 — 300 x10³
ECCN Code
EAR99
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Voltage
5 V
HTS Code
8541.21.0075
Junction Temperature (Tj)
-55 — 150 °C
Output Capacitance (Cob)
8 pF
Power Dissipation
625 mW
Storage Temperature (Tstg)
-55 — 150 °C
Turn Off Time (toff)
150 ns
Turn On Time (ton)
60 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 2,500 | LEAD or TIN | No | |
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 2,000 | PBFREE | ||
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 2,000 | PBFREE | ||
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Box | 2,000 | PBFREE | ||
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Ammo | 2,000 | LEAD or TIN | No | |
| Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | Tape & Reel | 2,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| 2N3641-3643.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:TO-92 process change eutectic | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |